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OCZ Technology Introduces the High-Speed Data Link (HSDL) Interface to Revolutionize Solid-State Storage Performance

SAN JOSE, Calif., Sept. 29, 2010 (GLOBE NEWSWIRE) -- OCZ Technology Group, Inc. (Nasdaq:OCZ), a leading provider of high-performance solid-state drives (SSDs) and memory modules for computing devices and systems, has unveiled a proprietary interface called "High-Speed Data Link" (HSDL) to accelerate the progression of solid-state storage. Unsatisfied with existing interface options, OCZ developed HSDL to eliminate I/O bottlenecks and enable SSD technology to operate at its full potential. With this initiative, OCZ aims to enhance high performance computing (HPC) and I/O-intensive infrastructures for its clients.
/ Source: GlobeNewswire

SAN JOSE, Calif., Sept. 29, 2010 (GLOBE NEWSWIRE) -- OCZ Technology Group, Inc. (Nasdaq:OCZ), a leading provider of high-performance solid-state drives (SSDs) and memory modules for computing devices and systems, has unveiled a proprietary interface called "High-Speed Data Link" (HSDL) to accelerate the progression of solid-state storage. Unsatisfied with existing interface options, OCZ developed HSDL to eliminate I/O bottlenecks and enable SSD technology to operate at its full potential. With this initiative, OCZ aims to enhance high performance computing (HPC) and I/O-intensive infrastructures for its clients.

"Solid State Drive throughput speeds are increasing at a rate in excess of what current storage buses can support, and as a result, storage protocols are quickly becoming the bottleneck to storage subsystem  performance," said Ryan Petersen, CEO of OCZ Technology. "Designed for both high-performance computing and enterprise storage applications, our new High Speed Data Link interface addresses this issue and revolutionizes data storage by significantly outperforming other current interfaces delivering performance at levels that saturate most CPU busses."   

Capable of running up to 20Gbps of data bandwidth per channel, HSDL significantly outperforms existing storage interfaces such as Serial ATA (SATA) and Serial Attached SCSI (SAS) which only offer 3Gbps/6Gbps data rates. Furthermore, multiple HSDL channels can be combined for maximum bandwidth to increase productivity levels in both consumer and enterprise applications. 

OCZ's new HSDL interface is the driving force behind the "OCZ IBIS," an upcoming 3.5-inch SSD to be launched under the new HSDL initiative. As the first solution to make use of the HSDL interface, the OCZ IBIS Series has the potential to redefine storage and surpass the limitations currently placed on hard drives as well as other SSDs.

HSDL is an open standard and allows other devices to leverage this high-speed internal interconnect technology. OCZ is diligently working with platform partners for mass HSDL adoption, and in the meantime, single port adapter cards will ship with every HSDL solid-state drive such as the IBIS Series, while quad port cards for multiple drive configurations will also be available to clients seeking even greater storage and bandwidth.

About OCZ Technology Group, Inc.

Founded in 2002, San Jose, CA-based OCZ Technology Group, Inc. ("OCZ"), is a leader in the design, manufacturing, and distribution of high performance and reliable Solid-State Drives (SSDs) and premium computer components. OCZ has built on its expertise in high-speed memory to become a leader in the SSD market, a technology that competes with traditional rotating magnetic hard disk drives (HDDs). SSDs are faster, more reliable, generate less heat and use significantly less power than the HDDs used in the majority of computers today. In addition to SSD technology, OCZ also offers high performance components for computing devices and systems, including enterprise-class power management products as well as leading-edge computer gaming solutions. For more information, please visit: www.ocztechnology.com.

The OCZ Technology Group, Inc. logo is available at

Forward-Looking Statements

Certain statements in this release relate to future events and expectations and as such constitute forward-looking statements involving known and unknown factors that may cause actual results of OCZ Technology Group, Inc. to be different from those expressed or implied in the forward-looking statements. In this context, words such as "will," "would," "expect," "anticipate," "should" or other similar words and phrases often identify forward-looking statements made on behalf of OCZ. It is important to note that actual results of OCZ may differ materially from those described or implied in such forward-looking statements based on a number of factors and uncertainties, including, but not limited to, market acceptance of OCZ's products and OCZ's ability to continually develop enhanced products; adverse changes both in the general macro-economic environment as well as in the industries OCZ serves, including computer manufacturing, traditional and online retailers, information storage, internet search and content providers and computer system integrators; OCZ's ability to efficiently manage material and inventory, including integrated circuit chip costs and freight costs; and OCZ's ability to generate cash from operations, secure external funding for its operations and manage its liquidity needs. Other general economic, business and financing conditions and factors are described in more detail in "Item 1A - Risk Factors" in Part II in OCZ's Annual Report on Form 10-K filed with the SEC on May 20, 2010. The filing is available both at www.sec.gov as well as via OCZ's website at www.ocztechnology.com. OCZ does not undertake to update its forward-looking statements.

CONTACT: OCZ Technology Group, Inc. Ryan M. Petersen, CEO 408-733-8400 The Investor Relations Group Investor Relations: Adam Holdsworth Public Relations: Mike Graff 212-825-3210