updated 2/24/2011 7:16:47 AM ET 2011-02-24T12:16:47

BILLERICA, Mass., Feb. 24, 2011 (GLOBE NEWSWIRE) -- Entegris, Inc. (Nasdaq:ENTG) announced today a joint development agreement with IBM (NYSE:IBM) to develop and test new filtration techniques for use in advanced semiconductor manufacturing.

The collaboration will focus on generating test data off of a new generation of Entegris filters and dispense systems that are used to dispense and filter imaging materials as part of the photolithography process in a semiconductor fab. Entegris, which is the only provider of both filters and dispense systems used for this application in the semiconductor industry, will work with IBM's technology team in East Fishkill, New York to develop new technologies for controlling impurities such as particles and bubbles that can negatively impact manufacturing yields.  The use of new materials, process chemistries, and photolithography techniques are presenting new challenges for the semiconductor industry as it develops technologies to manufacture next-generation chips that are smaller, more powerful, and which consume less power.

Gideon Argov, president and CEO of Entegris, said. "This agreement complements the work we have been doing with other industry consortia to demonstrate the benefits of effective filtration on process yields in sub 32-nanometer node semiconductor manufacturing. We are delighted to be able to partner with one of the technology pioneers in our industry."


Entegris provides a wide range of products for purifying, protecting and transporting critical materials used in processing and manufacturing in semiconductor and other high-tech industries. Entegris is ISO 9001 certified and has manufacturing, customer service or research facilities in the United States, China, France, Germany, Israel, Japan, Malaysia, Singapore, South Korea and Taiwan. Additional information can be found at www.entegris.com .

The Entegris, Inc. logo is available at http://www.globenewswire.com/newsroom/prs/?pkgid=3700

CONTACT: Steve Cantor
         VP of Corporate Relations
         Tel. 978-436-6750

© Copyright 2012, GlobeNewswire, Inc. All Rights Reserved


Discussion comments


Most active discussions

  1. votes comments
  2. votes comments
  3. votes comments
  4. votes comments

Data: Latest rates in the US

Home equity rates View rates in your area
Home equity type Today +/- Chart
$30K HELOC FICO 3.79%
$30K home equity loan FICO 4.99%
$75K home equity loan FICO 4.69%
Credit card rates View more rates
Card type Today +/- Last Week
Low Interest Cards 13.83%
Cash Back Cards 17.80%
Rewards Cards 17.18%
Source: Bankrate.com