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Aehr Test Systems Schedules Third Quarter Fiscal Year 2011 Earnings Release and Conference Call

FREMONT, Calif., March 16, 2011 (GLOBE NEWSWIRE) -- Aehr Test Systems (Nasdaq:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced that it will report financial results for the third quarter of fiscal 2011 ended February 28, 2011 after the market closes on Thursday, March 31, 2011.
/ Source: GlobeNewswire

FREMONT, Calif., March 16, 2011 (GLOBE NEWSWIRE) -- Aehr Test Systems (Nasdaq:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced that it will report financial results for the third quarter of fiscal 2011 ended February 28, 2011 after the market closes on Thursday, March 31, 2011.

Management of Aehr Test Systems will host a conference call and webcast that same day at 5:00 p.m. Eastern (2:00 p.m. Pacific) to discuss the Company's operating performance. The conference call will be accessible live via the internet at www.aehr.com. Please go to the website at least 15 minutes before start time to register, download and install any necessary audio software. A replay of the webcast will be available at www.aehr.com for 90 days.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of systems for burning-in and testing memory and logic integrated circuits and has an installed base of more than 2,500 systems worldwide. Aehr Test has developed and introduced several innovative products, including the ABTS™, FOX™ and MAX systems and the DiePak® carrier. The ABTS system is Aehr Test's newest system for packaged part test during burn-in for both low-power and high-power logic as well as all common types of memory devices. The FOX system is a full wafer contact test and burn-in system.  The MAX system can effectively burn-in and functionally test complex devices, such as digital signal processors, microprocessors, microcontrollers and systems-on-a-chip. The DiePak carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of bare die. For more information, please visit the Company's website at .

CONTACT: Gary Larson Chief Financial Officer (510) 623-9400 x321