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Axcelis Celebrates Shipment of 300th GSD/HE Series Implanter Marking Over 15 Years of Leadership in High Energy Implant

BEVERLY, Mass., June 22, 2011 (GLOBE NEWSWIRE) -- Axcelis Technologies, Inc. (Nasdaq:ACLS) today announced that the Company has shipped its 300th GSD/HE Series high energy implanter as part of a high volume order from one of the world's largest semiconductor foundries located in Asia. This recent shipment builds on the Company's significant installed base with the customer, who utilizes Axcelis' high energy systems in high volume logic, memory, and image sensor device manufacturing. Axcelis has the world's largest installed base of high energy implanters, with 70% market share in 2010.
/ Source: GlobeNewswire

BEVERLY, Mass., June 22, 2011 (GLOBE NEWSWIRE) -- Axcelis Technologies, Inc. (Nasdaq:ACLS) today announced that the Company has shipped its 300th GSD/HE Series high energy implanter as part of a high volume order from one of the world's largest semiconductor foundries located in Asia. This recent shipment builds on the Company's significant installed base with the customer, who utilizes Axcelis' high energy systems in high volume logic, memory, and image sensor device manufacturing. Axcelis has the world's largest installed base of high energy implanters, with 70% market share in 2010.

"We're very excited about reaching this milestone," said Mary Puma, chairman and CEO. "Axcelis was the driving catalyst for high energy implantation with the introduction of the groundbreaking GSD/HE and VHE implanter series, which set the industry standard for high energy technology. This introduction propelled high energy implant applications into mainstream device manufacturing, playing a pivotal role in accelerating the remarkable progression of Moore's law. The continued success of this product line is due to several contributing factors, including its superior technical performance, reliability and unmatched productivity. Since that time, we have continued to offer a succession of leading edge, high energy technologies, including our newest single wafer Optima XE series, to meet our customers' next generation requirements, and further strengthen our leadership position."

Axcelis' GSD/HE and VHE systems were designed to deliver exceptional productivity, lowest COO, and unmatched process flexibility. The tools provide the broadest range of ion implantation capability, from 10keV to 5MeV, to perform retrograde well, double well, triple well, channel and buried layer implants. Both systems utilize the production proven RF Linear Accelerator (LINAC) which delivers benchmark productivity, reliability and uptime performance. Axcelis introduced the first RF LINAC based system in 1986, with the introduction of the NV-1000 high energy implanter. Since that time, the RF LINAC has become the industry standard for high energy implant technology. The product line also includes the Optima XE Series of single wafer systems as well as the Paradigm Series of multi wafer systems. Together, they represent the only complete high energy solution capable of addressing all traditional and emerging high energy application requirements. For more information on the product line, please visit .

About Axcelis

Axcelis Technologies, Inc. (Nasdaq:ACLS) headquartered in Beverly, Massachusetts, provides innovative, high-productivity solutions for the semiconductor industry. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation and cleaning systems. For more information, visit Axcelis' website at www.axcelis.com.

CONTACT: Maureen Hart (editorial/media) 978.787.4266 Maureen.hart@axcelis.com Jay Zager (financial community) 978.787.9408 jay.zager@axcelis.com