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TI to double number of chips per wafer

Texas Instruments Inc. said Monday its new 45-nanometer chip-making process will double the number of chips produced on each silicon wafer, reducing power consumption and boosting processing speed.
/ Source: Reuters

Texas Instruments Inc. said Monday its new 45-nanometer chip-making process will double the number of chips produced on each silicon wafer, reducing power consumption and boosting processing speed.

TI, the biggest supplier of chips for mobile phones, said the new process could boost its device speeds by around 30 percent while reducing power consumption by 40 percent.

The process will also allow wireless users to run more simultaneous applications, such as playing games with 3-D graphics while running video conferences or receiving e-mail in the background, the company said.

The convergence of communication and entertainment on mobile devices has led to demand for lower power-consumption technologies.

TI said it developed what it believes to be the smallest 45-nm SRAM memory cell, occupying only 0.24 square microns, up to 30 percent smaller than other 45-nm memory cell devices announced to date.

Miniaturization boosts chip processing speed by cutting down on the distance the electric load must travel.

Earlier this month, the company raised its outlook for second-quarter earnings and revenue on strong demand across its chip business.