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Video Interview: Ralph Quinsey, President and Chief Executive Officer, TriQuint Semiconductor, Inc. (TQNT)

/ Source: GlobeNewswire

NEW YORK, March 8, 2011 (GLOBE NEWSWIRE) -- Veteran business journalist Joya Dass joins Ralph Quinsey, President and Chief Executive Officer, TriQuint Semiconductor, Inc. (TQNT), to discuss the company's industry, strategy, financials and positioning.

Click here to view video:

Ralph Quinsey

President and Chief Executive Officer

Ralph Quinsey joined TriQuint in July 2002 as President and Chief Executive Officer. From September 1999 to January 2002, Mr. Quinsey was with ON Semiconductor, a manufacturer of semiconductors for a wide array of applications, as Vice President and General Manager of the Analog Division. Prior to that, Mr. Quinsey was with Motorola, a manufacturer of semiconductors and communications equipment, from 1979 to September 1999, holding various positions including Vice President and General Manager of the RF/IF Circuits Division, which developed both silicon and gallium arsenide technologies for wireless phone applications. In January 2011 Volterra Semiconductor Corporation (Nasdaq:VLTR), a leading provider of high-performance analog and mixed-signal power management semiconductors, appointed Mr. Quinsey to its Board of Directors. Mr. Quinsey received a B.S. degree in electrical engineering from Marquette University.

About TriQuint Semiconductor, Inc. (TQNT):

Every time you use a mobile phone, tablet PC, or eReader, you're connecting through Radio Frequency (RF) technology. TriQuint Semiconductor designs, develops and manufactures innovative RF solutions for communications companies worldwide. We celebrated our 25th anniversary in 2010 and are a leader in market diversity serving customers in mobile device, 3G & 4G cellular base station, WLAN, cable/FTTH, optical, and defense & aerospace markets including communications and radar. TriQuint has the broadest in-house technology portfolio in the RF industry and is the only high-volume RF supplier with both active and passive technology. This offers unprecedented levels of integration that enables a complete RF front-end while delivering cost efficiencies and achieving compact, high-performance designs.   

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