Phase Leg Modules Use Silicon Carbide (SiC) Devices
Deliver Fast Switching Frequencies With Reduced Losses
IRVINE, Calif., May 19, 2011 (GLOBE NEWSWIRE) -- Microsemi Corporation (Nasdaq:MSCC), a leading provider of semiconductor technology aimed at building a smart, secure, connected world, today announced it has expanded its line of standard power modules to include a product that uses silicon carbide (SiC) devices for all diode and normally-off junction field effect transistor (JFET) functionality. The company previously only offered custom all-SiC power modules, but now is one of the first to also offer them as standard, off-the-shelf products.
"SiC technology is becoming increasingly important for improving system power performance and density while reducing product size and cooling requirements," said Philippe Dupin, Director, Power Module Products, for Microsemi's Power Products Group. "We are now extending our line of all-SiC power modules beyond custom solutions to include standard products that reduce costs and time to market for our customers."
Microsemi's APTJC120AM13VCT1AG phase leg SiC power module provides customers with a higher-performance alternative to the company's extensive line of all-silicon solutions. It operates at considerably higher rated junction temperatures than solutions using silicon IGBT and MOSFET devices, with switching losses that are 10 percent lower than modules featuring silicon MOSFETs, and 40 percent lower than those that incorporate silicon IGBTs. The modules enable the development of welding converters, switched mode and uninterruptible power supplies, and motor control systems used in solar, automotive, military/aerospace, medical and other demanding applications.
Microsemi's phase leg SiC power module features very low stray inductance, high integration levels and low junction-to-case thermal performance. It uses four 30 amp (A) diodes and eight 50 milliohm JFETs and is rated at 1200 volts (V) but has an on-state resistance, or RDS(on) of 13 milliohms. The power module is RoHS-compliant and housed in a low-profile, isolated package with direct mounting to a heatsink.
Pricing and Availability
The APTJC120AM13VCT1AG phase leg SiC power module is sampling now and volume production is scheduled to begin in the third quarter of 2011. Pricing is $739.31 per module in OEM quantities of 1,000.
Microsemi Corporation (Nasdaq:MSCC) offers the industry's most comprehensive portfolio of semiconductor technology. Committed to solving the most critical system challenges, Microsemi's products include high-performance, high-reliability analog and RF devices, mixed signal integrated circuits, FPGAs and customizable SoCs, and complete subsystems. Microsemi serves leading system manufacturers around the world in the defense, security, aerospace, enterprise, commercial, and industrial markets. Learn more at .
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"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to the expansion of its line of standard power modules to include a product that uses silicon carbide (SiC) devices for all diode and normally-off junction field effect transistor (JFET) functionality, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
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