SUNNYVALE, Calif., Nov. 11, 2010 (GLOBE NEWSWIRE) -- Alpha and Omega Semiconductor ( AOS ) (Nasdaq:AOSL) today announced the release of a highly integrated DFN3.3x3.3 dual MOSFET power stage optimized for synchronous buck DC-DC conversion. The AON7900 features an innovative packaging technology that allows multiple power devices to be stacked on top of each other to deliver more current in a smaller footprint. The new product enables high power density DC-DC solutions for advanced notebook computers, servers, graphics cards, and telecom applications.
A photo accompanying this release is available at
The AON7900 includes two of AOS' high performance Split Gate Technology (SGT) MOSFETs interconnected using AOS' proprietary die stacking technique. Compared to traditional dual packages where multiple dice are arranged side by side, the stacked approach has numerous benefits including higher power density enabled by lower on-resistance MOSFETs, and a simplified PCB footprint. The result is a single 10mm2 power device that can deliver more than 12A of output current in a typical 12Vin to 1.8Vout DC-DC application. This solution provides designers with a high level of functionality and performance in miniature package that simplifies PCB layouts and in many cases replaces two discrete packages.
- Synchronous buck power stage in a simplified 5 terminal DFN3.3x3.3 package
- Tuned 30V SGT MOSFET pair
- 17mOhms high-side, and 5.5mOhms low-side synchronous rectifier
- Low capacitance for high frequency operation with good immunity to induced noise
- One large exposed metal pad connected to the switch node
Pricing and Availability
The AON7900 is housed in a DFN3.3x3.3 package, and is available immediately in production quantities. The unit price of 1,000 pieces is US$0.75.
Alpha and Omega Semiconductor Limited, or AOS, is a designer, developer and global supplier of a broad range of power semiconductors, including a wide portfolio of Power MOSFET and Power IC products. AOS seeks to differentiate itself by integrating its expertise in device physics, process technology, design and advanced packaging to optimize product performance and cost, and its product portfolio is designed to meet the ever increasing power efficiency requirements in high volume applications, including portable computers, flat panel TVs, battery packs, portable media players and power supplies. For more information, please visit .
Forward Looking Statements
This press release contains forward-looking statements that are based on current expectations, estimates, forecasts and projections of future performance based on management's judgment, beliefs, current trends, anticipated product performance. These forward-looking statements include, without limitation, references to the efficiency and capability of new products. Forward-looking statements involve risks and uncertainties that may cause actual results to differ materially from those contained in the forward-looking statements. These factors include, but are not limited to, the actual product performance in volume production, the quality and reliability of the product, our ability to achieve design wins, the general business and economic conditions, the state of semiconductor industry, and other risks as described in the Company's annual report on Form 20-F and other filings with the U.S. Securities and Exchange Commission. Although the Company believes that the expectations reflected in the forward looking statements are reasonable, it cannot guarantee future results, level of activity, performance, or achievements. You should not place undue reliance on these forward-looking statements. All information provided in this press release is as of today's date, unless otherwise stated, and AOS undertakes no duty to update such information, except as required under applicable law.
The photo is also available via AP PhotoExpress.
CONTACT: Alpha and Omega Semiconductor Media Contact: Clara Chan 408.789.3233 email@example.com